MIL-PRF-31032/1D (W/ AMENDMENT-3), PERFORMANCE SPECIFICATION SHEET: PRINTED WIRING BOARD, RIGID, MULTILAYERED, THERMOSETTING PERFORMANCE SPECIFICATION SHEET: PRINTED WIRING BOARD, RIGID, MULTILAYERED, THERMOSETTING RESIN BASE MATERIAL, WITH OR WITHOU

MIL-PRF-31032/1D (W/ AMENDMENT-3), PERFORMANCE SPECIFICATION SHEET: PRINTED WIRING BOARD, RIGID, MULTILAYERED, THERMOSETTING PERFORMANCE SPECIFICATION SHEET: PRINTED WIRING BOARD, RIGID, MULTILAYERED, THERMOSETTING RESIN BASE MATERIAL, WITH OR WITHOUT BLIND AND BURIED PLATED−THROUGH HOLES, FOR SOLDERED PART MOUNTING (01-MAR-2020)., This specification covers the generic performance requirements for rigid, multilayered (three or more conductor layers) printed wiring boards (hereafter designated printed board) with plated holes, that will use soldering for component/part mounting (see 6.1.1)