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MIL-PRF-31032/2D, PERFORMANCE SPECIFICATION SHEET: PRINTED WIRING BOARD, RIGID, SINGLE AND DOUBLE LAYER, THERMOSETTING RESIN BASE MATERIAL, WITH OR WITHOUT PLATED-THROUGH HOLES, FOR SOLDERED PART MOUNTING (02-MAR-2020)

MIL-PRF-31032/2D, PERFORMANCE SPECIFICATION SHEET: PRINTED WIRING BOARD, RIGID, SINGLE AND DOUBLE LAYER, THERMOSETTING RESIN BASE MATERIAL, WITH OR WITHOUT PLATED-THROUGH HOLES, FOR SOLDERED PART MOUNTING (02-MAR-2020)., This specification covers the generic performance requirements for rigid, single and double sided (1 or 2 conductor layers) printed wiring boards (hereafter designated printed board) with or without plated holes that will use soldering for component/part mounting (see 6.1.1).

MIL-PRF-31032/2 Rev. D

    

Version:
D03-2020393.34 KB MIL–PRF−31032_2D
B08-2010280.55 KB MIL-PRF-31032-2B

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